Micro Abrasive Blasters

Precision, Controllability | Silicon Wafers Processing for MEMS Applications

The company has developed integrated workstations and work cells as well that provide turn-key answers for applications such as conformal coating removal, controlled erosion, surface preparation, deburring, medical device cleaning, etc.

MICRO ABRASIVE BLASTING TECHNOLOGY FOR MEMS

We have proven a track record of success in micromachining processes that selectively etch away parts of the wafer substrate. The technology is in use on a number of Micro-Electro-Mechanical Systems (MEMS) for integration of mechanical elements, sensors, and electronics for a wide range of applications. Our customers are able to produce complex electrical, mechanical, thermal, optical mechanical, fluidic, magnetic structures and devices.

WAFER MICRO-MACHINING AND CORING

Our micro abrasive blasting technology has the required precision and control to core all types of wafers as required by semi-conductor manufacturers and biomedical engineering companies. It also has other applications which include etching patterns, features, fiducial targets, vias or through holes and pockets into all types of semi-conductor materials.

Applications

  • Conformal Coating Removal
  • Wafer processing, Edge beveling
  • Deburring
  • Cleaning Medical Devices
  • Machine Cutting
  • De-Junking
  • Demolding
  • Refined Machining