Hermetic Package Sealing

Vacuum Pressure Furnace

Processes

Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices.

Hermetic Package Sealing. Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Applications

  • Automotive diodes
  • CPV solar cell modules
  • EMI filters
  • Fiber optic devices
  • Flip chips
  • GaN MMICs
  • Hearing aid amplifiers



  • Microwave packages
  • Miniature crystals
  • MMICs
  • Oscillators
  • Pacemakers
  • Power modules
  • Precision capacitors


  • Hermetic feed-throughs
  • Implantable medical devices
  • Laser pump diodes
  • LED lamps and heaters
  • RF amplifiers
  • Surge suppressors
  • Resistor networks

Products

  • 1200 TABLE TOP FURNACE

The SST 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components.

The 1200 table top furnace is ideal for small labs and R&D facilities. Void-free solder joints are most reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

  • 3130 HIGH VACUUM FURNACE

The SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed offline. The system is used in both production and research environments for flux-free soldering, brazing, annealing, and glass sealing of components and packages for microelectronic applications.

  • 5100 VACUUM PRESSURE FURNACE

The SST 5100 is a vacuum and pressure furnace that provides precise automatic control of heating and cooling ramp rates. This system allows for heating up to 500°C and cooling in an inert gas environment from vacuum levels below 50 millitorr to pressures up to 40 psig. An unlimited number of process profiles can easily be created and stored in the controller. Process heating is provided over the entire work area by a close-coupled planar infrared heating element. The system is designed for high production flux-less void-free soldering.

  • 518 VACUUM/PRESSURE FURNACE

The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.