Update on recent developments
Front End
Annealing
Annealsys has developed a process for annealing LiNbO3 and LiTaO3 piezoelectric and pyroelectric materials. Being very sensitive to temperature gradients materials in the AS-Premium.
Back End
Die Bonding
Get the highest performing eutectic die attach capabilities in the market (pulsed heat tool, pulse heat stage, pulse heat bullet stage). Palomar 6500 die bonder.
Characterization
Metrology tool, Characterization
[1] "Morphological effect on high compaction density nickel-rich layered oxide cathodes during electrochemical lithiation and delithiation," was recently published by Electrochimica Acta. kSA MOS was used for real-time measurements of stress evolution in the electrode during electrochemical lithiation and delithiation.
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[2] Growth of AlN on sapphire: Predicting the optimal nucleation density by surface kinetics modeling" discusses interesting research by scientists out of the Centre for Nano Science and Engineering at the Indian Institute of Science. In the research, they used the kSA ICE (integrated control for epitaxy) to measure deposition rate, surface temperature, and substrate curvature during growth.
Materials
Storage Boxes for sensitive devices
[1] New product platforms being launched Gel-Pak division.
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[2] Designed to prevent semiconductor components from migrating out of pockets of waffle pack trays.