Micro Solder Ball Mount System
Micro Solder Ball Mount System
Wafer, Panel and Substrate Level
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Wafer Level - Wafer level Ball mount is a process used in wafer-level packaging. It involves placing tiny solder balls onto a wafer. 8inch, 10inch, 12inch Wafer Micro Solder Ball Mount.
Panel (Fan-out) Level - Instead of round wafers, we can provide panel level packing ball mount solutions. ~300mm Panel, Micro Solder Ball Mount.
Substrate Level - Enhance Micro Solder Ball Mount on Substrate
Features
Features
Ball placement system for single unit package. Able to handle different types of balls as using dual-head
Applicable package: FCBGA, HFCBGA
Carrier format: 75-200mm in width x 250-320mm in length
Applicable ball pitch/size
Ball pitch: 0.4mm and over
Ball size: 0.2mm and over
Physical spec: 3300mm(L) x 2100mm(W) x 2336mm(H) / 3500kg
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