Applications

Spin Coater Tools

For decades the process of spin coating has been used to apply a resist film over a silicon wafer as part of the broader process of microcircuit fabrication necessary to produce high yielding silicon wafers.

BEOL Processes For Semiconductor Lithography

BEOL semiconductor tools for WLCSP (Wafer level chip scale packaging) take advantage of many lithographic techniques utilized in the manufacture of the chip in the Front End of Line (FEOL).

Photoresist Coat and Develop

Our resist processing systems like the Scene 12 employ advanced Meta-Form design pushing the cost-performance curve…

Polyimide Coat and Develop, Negative Tone

Our unique hot plate oven design eliminates the possibility of solvent reflux. Our robotic handling ensures contaminant free back side cleanliness.

Coating of Photo Active and Non Photo Active Protective Films in WLCSP

Industry leading film thickness uniformities for these viscous and difficult to coat polymers

TMAH Puddle Develop Negative and Positive Tone

As the aqueous develop is essentially an etch, it is important that corrosion rather than erosion be the only process so that develop “hot spots” can be avoided.

Photoresist Processing of Lithium Niobate And Other Pyroelectric Substrates

The primary difficulty in coating substrates of pyroelectric materials is that the materials will build substantial charges leading to very high voltages when heated.

Thick Photoresist Films Processing For Copper Pillar And Gold Bump Processes

In the formation of both gold bumps and copper pillars it is required to contain the “plated up” structure within a “mold” of polymer material.

Solder Flux Deposit, Reflow and Flux Clean

Small footprint fully automated single wafer reflow processing using flux and flux cleaning spinners robotically coupled to atmospheric controlled reflow hot plates.

Wafer Edge Exposure

Wafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed.

Lift Off Resist (LOR) Processing

The S-Cubed LOR processor is designed to perform both LOR and Photoresist Patterning processes automatically and sequentially.

Negative Tone Lift Off Resist Processing

Effective negative LOR processing requires excellent film thickness uniformity & precise, repeatable control of hot plate baking conditions.

Metal Lift Off Cleaning

Fully automated single wafer lift-off using both high pressure dispense of solvents, and/or immersed and heated “soaks”.

Photoresist Stripping and Rework Cleaning

Our Scene 12 provides fully automated single wafer stripping using both high pressure dispense of solvents, and/or immersed and heated “soaks”.

WEE Combined with Develop

Minimizes work in process inventory by combining the WEE and develop processes in a single automated tool.

WEE Processing Of Negative Tone Resists For Protective Seal Rings

Wafer Exposure is a process wherein Photoresist at or near the edge of the wafer is exposed.