Automatic Bonders

  • Wedge Bonder

The Wedge Bonder is a high-speed fine wire wedge and ribbon bonder driven by voice coil technology in the bond head. This machine has interchangeable 45-60° and 90° deep access wedge clamps and operates across a single large 304 x 152 mm work area. As the entire bond head mechanism rides on theta, users realize excellent wire tension, a shorter wire feed path and inherent prevention of twisting of wire and ribbon, and better overall process control.

  • Ball Bonder

This Bonder is a fully automated thermosonic high-speed, ball-and- stitch wire bonder capable of ball bumping, stud bumping, wafer bumping, and chip bumping, and customized looping profiles. As the assembly method of choice for first level interconnection, it’s suited for many aspects of packaging and component assembly, including complex hybrids, MCMs, and high- reliability devices.

Die Bonders

Palomar 6532HP Die Bonder

Developed for the demanding needs for the optoelectronics market, the 6532HP exceeds industry standards for placement accuracy and production speed. 1.5 micron high precision placement accuracy and speeds up to 1200 UPH means maximum throughput for you and your customers. Automated presentation of dual 8” wafers, or up to 72 wafflepacks, or tape dispensers provides a high production, flexible parts presentation platform. The 6 position, bi-directional tool turret allows “on-the-fly” tool changes to maximize speed and flexibility.

Palomar 3880 Die Bonder

The 3880 Die Bonder is designed for fully automated epoxy and eutectic die attach processes. Its innovative integrated Z-Theta bidirectional 8-tool bond head makes it the fastest and most reliable multiple die-type bonder on the market. The continuous improvement on this platform delivers significant advancements in force uniformity; robust vision referencing, die placement planarity, and high-speed tool indexing provide users a flexible, reliable and high-performing machine for micron-level placement and assembly.