Scanning Acoustic Microscope
Non-Destructive Inspection of bonded wafers and packaged semiconductors
Manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level.
Complete line of non-destructive testing (NDT) solutions optimized for finding defects and improving process control in bonded wafers including MEMS, CMOS image sensors, memory, LED, TSV(Through Silicon Via), and other demanding applications.
Bonded Wafer Inspection
Microelectromechanical Systems - MEMS Inspection
Through-Silicon Vias - TSV Inspection
Backside Illuminated (BSI) Sensor Inspection
Non-Destructive Testing (NDT) solution for package inspection for package inspection of stacked dies, complex flip chips and more traditional plastic packages adding industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications.
Molded Underfill (MUF) Inspection
Stacked Die Imaging (SDI)
Flip Chip Inspection
Wafer Chip Scale Package (CSP) Inspection
Ball Grid Arrays
Plastic-Encapsulated IC Inspection
Hybrid and Multi-Chip Module (MCM) Package Inspection