Scanning Acoustic Microscope

Non-Destructive Inspection of bonded wafers and packaged semiconductors


Manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level.

Complete line of non-destructive testing (NDT) solutions optimized for finding defects and improving process control in bonded wafers including MEMS, CMOS image sensors, memory, LED, TSV(Through Silicon Via), and other demanding applications.


Bonded Wafer Inspection

Microelectromechanical Systems - MEMS Inspection

LED Inspection

Through-Silicon Vias - TSV Inspection

Backside Illuminated (BSI) Sensor Inspection


Non-Destructive Testing (NDT) solution for package inspection for package inspection of stacked dies, complex flip chips and more traditional plastic packages adding industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications.


Molded Underfill (MUF) Inspection

Stacked Die Imaging (SDI)

Flip Chip Inspection

Wafer Chip Scale Package (CSP) Inspection

Ball Grid Arrays

Plastic-Encapsulated IC Inspection

Hybrid and Multi-Chip Module (MCM) Package Inspection